Daily Archives: August 17, 2016

1366科技发布3D硅片

1366科技开发了带厚边的超薄硅片从而避免碎片

http://www.pv-tech.org/products/1366-technologies-develops-thin-wafers-with-thick-border-to-limit-breakage

1366科技发布3D硅片，成功融资并签署重要合作伙伴

http://www.greentechmedia.com/articles/read/1366-technologies-unveils-new-wafer-technology